Signal & Power Integrity
For High-speed Pcb plan, has become almost essential make signal analysis of pre and post layout (Signal Integrity)
In recent years, thanks to new tools available, we can also perform analisys dedicated to the power distribution (Power Integrity).
In very fast boards, is no less important the increase of the thermal density on the PCB, which may introduce problems that would result in increate cost and time, especially in the production process. With these results we can already anticipate issues when designing the PCB.